 |
Digital Matrix
Rotational Electroforming Machine |
| |
| |
|
| Since 1984, Digital Matrix has been manufacturing electroforming systems for the CD and DVD manufacturing industry world-wide. Digital Matrix has also been at the forefront in the development of stamper manufacturing of the new generation Blu-Ray and HD DVD formats. Digital Matrix has been involved in the plating MEMS applications throughout the world. A diverse array of challenging structures and applications have been achieved using various process techniques developed by DM in conjunction with our clients and partners around the globe. LIGA and over photoresist methods have been employed. |
Digital Matrix
Large Shims Forming Machine
|
|
| |
|
| Digital Matrix is one of the leading manufacturers of ELECTROPLATING equipment for the FLAT PANEL DISPLAY and ARRAY STRUCTURES industry. With the ability to plate shims up to 1.35 Meters in many different metals, and achieve demanding flatness and thickness uniformity requirements. Our high-speed precision systems, can plate within +/-5% of total thickness variation in a fraction of the time of our competitors. Digital matrix standard plating tank models can be built to custom sizes to meet your requirements. |
Digital Matrix
Nickel - Phosphorus Roller Plating (NiP) |
|
|
| |
|
Plated Nickel-Phosphorus alloy (NiP) is used where a hard surface layer is required. The hardness and amorphous (non-crystalic) characteristics of the NiP deposits make it especially suitable for diamond machining of embossing rollers and stamping tools. Digital Matrix has perfected an Electrolytic NiP plating process which yields excellent defect free results. Phosphorus content can be controlled in the range of 10% to 15%. |
Digital Matrix
Electroforming |
|
|
| |
|
| Digital Matrix offers specialized process support for application specific electroplating. This includes Alloy plating such as Nickel-Phosphorus and Nickel-Cobalt. |
Digital Matrix
Precision Electroforming |
|
| |
|
| We provide the process for precision electroplating of precious metals onto wafers. Gold, Gold-Alloy. Silver, Silver Alloy. Tungsten, Tungsten Alloy. Palladium, Palladium Alloy. Rhodium, Rhodium Alloy. |
|
 |